TY  - GEN
AU  - Harper, Charles A.
TI  - Electronic assembly fabrication: chips, circuit boards, packages and components
SN  - 0071378820
U1  - 621.381 
PY  - 2002///
CY  - New York
PB  - McGraw Hill
KW  - ELECRONICS, COMMUNICATIONS ENGINEERING
KW  - ELECTRONICS
KW  - ENGINEERING
ER  -